Integration of functions in MOEMS with laser-based technology
Selective laser-induced etching
Selective Laser-induced Etching (SLE) stands as a cutting-edge production technology, for transparent brittle materials like glasses (ULE/Fused Silica/BF33) and crystals (Sapphire/YAG/Quartz). Through SLE, intricate 3D freeform structures become achievable, enabling the seamless integration of diverse functionalities such as mechanical (flexures), optical (micro lenses), and electrical functions within the 3D-optical microdevices.
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SLE for flexures in MEMS
SLE enables machining of brittle materials with almost no sub-surface damages. With this feature you can cut them so thin, that they become flexible again. This is very useful for making flexures in MEMS devices.
SLE and welding for large-scale microfluidics
The etching process has a diffusion limit for channels longer than ~10mm. To overcome this limit we use ultrashortpulse welding to hermetically encapsulate channel systems.
Selective laser assisted metallization (SLAM)
Surface modification with USP laser radiation can selectively create spots for metal deposition, thus integrating electrical functions like capacitors or RFID antennas into glass devices.
SLE polishing for micro optics
Surfaces machined with SLE feature a roughness that usually is not sufficient for optical applications. Laser-Polishing can be applied to have free-form surfaces that serve optical functions like microlens arrays.